Patents Assigned to Thermaltake Technology Co., Ltd.
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Patent number: 10648597Abstract: A pipe connector structure includes a base, having a through hole and a revealed upper surface, comprising a first thread portion for connecting to an intercommunicating device and a second thread portion located on the first thread portion; a lid, having a central through hole; a sleeve, accommodated in the lid; and a first O-ring, disposed at the revealed upper surface and encircling the through hole. The lid includes an inner thread structure corresponding to a thread of an outer sidewall of the second thread portion. Accordingly, a user is capable of accurately cutting a water cooling pipe having an appropriate length according to the revealed upper surface of the pipe connector structure, thereby effectively solving issues of being uncertain whether the water cooling pipe is completely inserted into the base and being likely inserted in an unaligned manner as well as reducing risks of liquid leakage.Type: GrantFiled: June 20, 2017Date of Patent: May 12, 2020Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 10306716Abstract: A control signal switching system generates a light emitting module control signal for controlling a light emitting module, and the control signal switching system has a switching module and a transmission module. The switching module receives a switching control signal, a first control signal and a second control signal and output one control signal selected from the first control signal and the second control signal according to the switching control signal. The transmission module is connected to the switching module for receiving the one control signal selected from the first control signal and the second control signal and generates the light emitting module control signal for transmitting to the light emitting module. Therefore, the light emitting module is in operation according to the light emitting module control signal.Type: GrantFiled: August 14, 2018Date of Patent: May 28, 2019Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 10251298Abstract: A computer case has a box having a back board with an opening; and a graphics card fixing board having a plurality of graphics card shields, wherein the graphics card fixing board corresponds in position to the opening of the back board and thereby is unfastenably attached to the back board of the box either longitudinally or transversely, allowing the graphics card shields to be lengthwise parallel to a height of the box whenever the graphics card fixing board is attached to the back board of the box longitudinally, and allowing the graphics card shields to be lengthwise perpendicular to the height of the box whenever the graphics card fixing board is attached to the back board of the box transversely. Therefore, a graphics card is selectively mounted in place, lying or upright, in the computer case.Type: GrantFiled: June 19, 2018Date of Patent: April 2, 2019Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 10237943Abstract: A ring-shaped light-emitting heat-dissipating fan comprises a base having a ring-shaped frame and a pivot portion; a fan pivotally disposed at the pivot portion; a ring-shaped light guide having an upper top surface, a lower top surface, an inner lateral surface, and an outer lateral surface; a lid disposed on the ring-shaped frame, with the ring-shaped light guide disposed between the base and the lid, and a receiving space formed between the lid and the ring-shaped light guide; and a ring-shaped circuit board disposed on an upper top surface of the ring-shaped light guide in the receiving space and having thereon a plurality of light-emitting elements arranged annularly. Therefore, the ring-shaped flat region dispenses with any receiving recesses for receiving the light-emitting elements. The ring-shaped circuit board controls color of light emitted from the light-emitting elements and their light emission cycles.Type: GrantFiled: February 16, 2017Date of Patent: March 19, 2019Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 9506663Abstract: A light-emitting heat-dissipating device includes a base, a light-emitting annular set, a fan and a cover. The base has an annular frame and a pivotal connection portion. The light-emitting annular set is annularly disposed at the annular frame of the base. The fan is pivotally disposed at a pivotal connection portion of the base. The cover is disposed on the annular frame of the base. The light-emitting annular set is annularly disposed between the cover and the base such that the light-emitting annular ring is not subjected to any external force or weight and thereby not predisposed to damage. The light-emitting annular set enables a halo with uniformly-distributed brightness to be formed above the light-emitting heat-dissipating device.Type: GrantFiled: May 4, 2015Date of Patent: November 29, 2016Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 9104250Abstract: A real-time quantifying system for use in quantifying input device user behavior is introduced. The real-time quantifying system performs real-time quantification on user behavior of at least an input device operating and controlling a computer apparatus. The real-time quantifying system includes an input device and a portable electronic device connected thereto by wireless connection. The input device includes a sensing module and a wireless communication module. Various data detected during a process of operation of the computer apparatus by a user are sent by the input device to the portable electronic device in real time. Then, the data are processed by the portable electronic device to generate a graphical data for display. Accordingly, the real-time quantifying system displays the user's control status in real time and assesses the user's attributes and user behavior according to the graphical data.Type: GrantFiled: July 11, 2013Date of Patent: August 11, 2015Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 7675751Abstract: A frame-type computer cooling device for installation in a host computer is provided. The host computer has a heat-generating source and a slot compartment. The slot compartment communicates with the inside of the host computer and the outside of the host computer. The frame-type computer cooling device includes a frame and a cooling circulation device. The frame is insertedly disposed in the slot compartment and includes a receiving recess. The cooling circulation device includes an evaporator, a compressor, a condenser, and an expansion valve connected to one another by a pipeline filled with a coolant. The compressor, the condenser, and the expansion valve are received in the receiving recess. The evaporator adjoins the heat-generating source. Accordingly, the cooling circulation device is easy to install, and heat dissipation of the heat-generating source is swift and efficient.Type: GrantFiled: July 17, 2008Date of Patent: March 9, 2010Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Hsi Lin
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Publication number: 20090272144Abstract: An improved computer cooling apparatus includes: a heat absorbing unit, having at least one water cooling block, a pump connected to the water cooling block, and a heat exchanger connected to the pump, and a first working fluid flows through the water cooling block, the pump and the heat exchanger; and a cooling unit, having an evaporator attached onto the heat exchanger, a compressor connected to the evaporator, a condenser connected to the compressor, and an expansion valve connected to the condenser, and a second working fluid flows through the evaporator, the compressor, the condenser and the expansion valve. The heat absorbing unit absorbs a related heat source in a computer, and a cooling unit dissipates the heat to provide a quick way of dispersing the heat source and a better heat dissipating effect.Type: ApplicationFiled: May 2, 2008Publication date: November 5, 2009Applicant: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Publication number: 20090272143Abstract: An improved computer cooling apparatus includes: at least one evaporator installed on a surface of at least one heat generating source which is a central processing unit in a computer system unit; a compressor, connected to the evaporator; a condenser, connected to the compressor; an expansion valve, connected between the condenser and the evaporator; a fan, installed on a side of the condenser; and a coolant, circulating among the evaporator, the compressor, the condenser and the expansion valve. The evaporator, compressor, condenser, fan, expansion valve and coolant are used for achieving the effect of quickly dispersing a heat generating source in the computer system unit.Type: ApplicationFiled: May 2, 2008Publication date: November 5, 2009Applicant: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: 7323776Abstract: The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connected to a top portion of the thermal substrate, and a bending part which is bended and extended upward away from the thermal substrate. A plurality of sets of heat fins connecting to end portions of the bending part of the heat conductive pipe are supported and elevated by the heat conductive pipe so that an air space is formed between the thermal substrate and the sets of heat fins. A fan locating on a top part of the heat fins, wherein a plurality of air passages are formed in between those heat fins so that cool air ventilates from the fan through the air passages of the heat fins to the thermal substrate.Type: GrantFiled: December 2, 2005Date of Patent: January 29, 2008Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-His Lin
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Patent number: D501008Type: GrantFiled: March 16, 2004Date of Patent: January 18, 2005Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Shi Lin
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Patent number: D502948Type: GrantFiled: February 4, 2004Date of Patent: March 15, 2005Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Shi Lin
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Patent number: D505426Type: GrantFiled: May 28, 2004Date of Patent: May 24, 2005Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Shi Lin
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Patent number: D510934Type: GrantFiled: September 9, 2003Date of Patent: October 25, 2005Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Shi Lin
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Patent number: D513752Type: GrantFiled: July 30, 2004Date of Patent: January 24, 2006Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Shi Lin
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Patent number: D561710Type: GrantFiled: January 3, 2007Date of Patent: February 12, 2008Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Hsi Lin
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Patent number: D561711Type: GrantFiled: January 4, 2007Date of Patent: February 12, 2008Assignee: Thermaltake Technology Co., Ltd.Inventor: Pei-Hsi Lin
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Patent number: D783594Type: GrantFiled: October 26, 2015Date of Patent: April 11, 2017Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: D783595Type: GrantFiled: October 26, 2015Date of Patent: April 11, 2017Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin
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Patent number: D1012571Type: GrantFiled: February 1, 2021Date of Patent: January 30, 2024Assignee: THERMALTAKE TECHNOLOGY CO., LTD.Inventor: Pei-Hsi Lin