Communications module
- Intel
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Description
FIG. 1 is a top, front, left side perspective view of the communications module;
FIG. 2 is a top, rear, left side perspective view of the communications module;
FIG. 3 is bottom, front, right side perspective view of the communications module;
FIG. 4 is bottom, rear, right side perspective view of the communications module;
FIG. 5 is a top plan view of the communications module;
FIG. 6 is a front elevation view of the communications module;
FIG. 7 is a rear elevation view of the communications module;
FIG. 8 is a right side elevation view of the communications module; and,
FIG. 9 is a left side elevation view of the communications module.
Claims
The ornamental design for a communications module, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D502465
Type: Grant
Filed: Oct 15, 2002
Date of Patent: Mar 1, 2005
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Ian A. Laity (Simi Valley, CA), Michael R. Smither (Castaic, CA)
Primary Examiner: Pamela Burgess
Attorney: Blakely, Sokoloff, Taylor & Zafman, LLP
Application Number: 29/169,201
Type: Grant
Filed: Oct 15, 2002
Date of Patent: Mar 1, 2005
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Ian A. Laity (Simi Valley, CA), Michael R. Smither (Castaic, CA)
Primary Examiner: Pamela Burgess
Attorney: Blakely, Sokoloff, Taylor & Zafman, LLP
Application Number: 29/169,201
Classifications