Communications module

- Intel
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Description

FIG. 1 is a top, front, left side perspective view of the communications module;

FIG. 2 is a top, rear, left side perspective view of the communications module;

FIG. 3 is bottom, front, right side perspective view of the communications module;

FIG. 4 is bottom, rear, right side perspective view of the communications module;

FIG. 5 is a top plan view of the communications module;

FIG. 6 is a front elevation view of the communications module;

FIG. 7 is a rear elevation view of the communications module;

FIG. 8 is a right side elevation view of the communications module; and,

FIG. 9 is a left side elevation view of the communications module.

Claims

The ornamental design for a communications module, as shown and described.

Referenced Cited
U.S. Patent Documents
D366463 January 23, 1996 Ive et al.
D370904 June 18, 1996 Nakata et al.
D415479 October 19, 1999 Yang et al.
D432540 October 24, 2000 Laity et al.
D452495 December 25, 2001 Murnaghan et al.
D452496 December 25, 2001 Murnaghan et al.
D452863 January 8, 2002 Madsen et al.
D458935 June 18, 2002 Hiroki
Patent History
Patent number: D502465
Type: Grant
Filed: Oct 15, 2002
Date of Patent: Mar 1, 2005
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Ian A. Laity (Simi Valley, CA), Michael R. Smither (Castaic, CA)
Primary Examiner: Pamela Burgess
Attorney: Blakely, Sokoloff, Taylor & Zafman, LLP
Application Number: 29/169,201
Classifications