Circuit board

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Description

FIG. 1 is a front perspective of the invention.

FIG. 2 is a plan elevation of the invention.

FIG. 3 is a bottom plan of the invention.

FIG. 4 is a front elevation of the invention.

FIG. 5 is a rear elevation of the invention.

FIG. 6 is a right end elevation of the invention; and,

FIG. 7 is a left end elevation of the invention.

The broken lines define the boundary of the claimed design and form no part of the claimed design.

Claims

The ornamental design for a circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
4651416 March 24, 1987 DePaul
D292698 November 10, 1987 DeVita et al.
5148350 September 15, 1992 Chan et al.
5296652 March 22, 1994 Miller, Jr.
5903441 May 11, 1999 Dean et al.
6235995 May 22, 2001 Cheng et al.
6479755 November 12, 2002 Kim et al.
6606250 August 12, 2003 Shi
Patent History
Patent number: D508681
Type: Grant
Filed: May 1, 2003
Date of Patent: Aug 23, 2005
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Janos-Gerold Enderlein (Berlin), Jörg Romahn (Berlin)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Morrison & Foerster LLP
Application Number: 29/180,814