Headphone
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FIG. 1 is a front elevational view of a headphone showing our new design, wherein lines VI—VI and VI′—VI′ are shown;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof,
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a partially enlarged view thereof, taken between the lines VII—VII and VII′—VII′ shown in FIG. 1;
FIG. 7 is a perspective view thereof;
FIG. 8 is a reference perspective view thereof, showing a using condition; and
FIG. 9 is a reference perspective view thereof, showing another using condition; and,
FIG. 10 is a reference right side elevational view thereof.
The broken lines showing of the environment are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a headphone, as shown and described.
Type: Grant
Filed: Nov 10, 2004
Date of Patent: Dec 27, 2005
Assignee: Sony Computer Entertainment Inc. (Tokyo)
Inventors: Maki Hirakawa (Tokyo), Michio Deguchi (Tokyo), Kanae Fukamatsu (Tokyo)
Primary Examiner: Paula A. Greene
Attorney: Rader, Fishman & Grauer PLLC
Application Number: 29/216,857