Headphone
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FIG. 1 is a perspective view of a headphone showing our new design;
FIG. 2 is a front elevational view thereof, showing lines VII—VII and VII′—VII′ are shown;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof, showing lines VIII—VIII and VIII′—VIII′, a bottom plan view thereof being a mirror image of the top plan view;
FIG. 7 is a partially enlarged front elevational view, taken along between the lines VII—VII and VII′—VII′ shown in FIG. 2, showing lines X—X and XI—XI;
FIG. 8 is a partially enlarged top plan view, taken along between the lines VIII—VIII and VIII′—VIII′ shown in FIG. 6;
FIG. 9 is a reduced perspective view, showing a using condition;
FIG. 10 is a reference enlarged cross sectional view, taken along the line X—X shown in FIG. 7; and,
FIG. 11 is a reference enlarged cross sectional view, taken along the line XI—XI shown in FIG. 7.
The broken lines showing of the environment are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a headphone, as shown and described.
Type: Grant
Filed: Nov 10, 2004
Date of Patent: Feb 7, 2006
Assignee: Sony Computer Entertainment Inc. (Tokyo)
Inventors: Maki Hirakawa (Tokyo), Michio Deguchi (Tokyo)
Primary Examiner: Paula A. Greene
Attorney: Rader, Fishman & Grauer PLLC
Application Number: 29/216,863