Electronic component cooling apparatus

- Sanyo Denki Co., Ltd.
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Description

FIG. 1 is a front side elevation view.

FIG. 2 is a rear side elevation view.

FIG. 3 is a right side elevation view.

FIG. 4 is a left side elevation view.

FIG. 5 is a top plan view.

FIG. 6 is a bottom plan view; and,

FIG. 7 is a perspective view.

Claims

The ornamental design for an electronic component cooling apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
5597034 January 28, 1997 Barker et al.
D403760 January 5, 1999 Kodaira et al.
D441724 May 8, 2001 Chou et al.
D441725 May 8, 2001 Chou et al.
D442565 May 22, 2001 Chou et al.
D442566 May 22, 2001 Chou et al.
D450306 November 13, 2001 Lin et al.
6407919 June 18, 2002 Chou
6418020 July 9, 2002 Lin
6419007 July 16, 2002 Ogawara et al.
D464939 October 29, 2002 Chuang et al.
6480383 November 12, 2002 Kodaira et al.
D476958 July 8, 2003 Tsai
6671172 December 30, 2003 Carter et al.
D501450 February 1, 2005 Watanabe et al.
Foreign Patent Documents
1019375 August 1998 JP
Patent History
Patent number: D516526
Type: Grant
Filed: Dec 23, 2003
Date of Patent: Mar 7, 2006
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Masayuki Iijima (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rakin, Hill, Porter & Clark LLP
Application Number: 29/196,216
Classifications
Current U.S. Class: Heat Sink (D13/179)