Headphone
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FIG. 1 is a perspective view of a headphone showing our new design;
FIG. 2 is a front elevational view thereof, showing lines V—V and V′—V′;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof, showing lines VI—VI and VI′—VI′, a bottom elevational view thereof being a mirror image of the top plan view;
FIG. 5 is a partially enlarged front elevational view thereof, taken along between the lines V—V and V′—V′ shown in FIG. 2;
FIG. 6 is a partially enlarged top plan view thereof, taken along between the lines VI—VI and VI′—VI′ shown in FIG. 4, showing a line X—X;
FIG. 7 is a partially enlarged front elevational view thereof, which is the same view as that shown in FIG. 5, showing a line XI—XI; and,
FIG. 8 is a perspective view thereof, showing a using condition;
FIG. 9 is a reference partially enlarged cross sectional view thereof, taken along the line XI—XI shown in FIG. 7;
FIG. 10 is a reference enlarged cross sectional view thereof, taken along the line X—X shown in FIG. 6;
FIG. 11 is a reference rear elevational view thereof; and,
FIG. 12 is a reference left side elevational view thereof.
The broken lines showing of the environment and the reference views are for illustrative purposes only and form no part of the claimed design. The dash-dot lines define, but are not included in, the boundaries of the claimed design.
Claims
The ornamental design for a headphone, as shown and described.
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Type: Grant
Filed: Nov 10, 2004
Date of Patent: May 23, 2006
Assignee: Sony Computer Entertainment Inc. (Tokyo)
Inventors: Maki Hirakawa (Tokyo), Michio Deguchi (Tokyo), Kanae Fukamatsu (Tokyo)
Primary Examiner: Paula A. Greene
Attorney: Rader, Fishman & Grauer PLLC
Application Number: 29/216,864