Heat sink

- Sanyo Denki Co., Ltd.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

This article is formed with a plurality of metallic fins which are integrally provided on a metallic base. This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.

FIG. 1 is a front side elevation view.

FIG. 2 is a right side elevation view.

FIG. 3 is a top plan view.

FIG. 4 is a bottom plan view; and,

FIG. 5 is a perspective view.

The rear side elevation view is omitted because it appears the same way as the front side elevation view. Likewise, the left side elevation view is omitted because it appears the same way as the right side elevation view.

Claims

The ornamental design for a heat sink, as shown and described.

Referenced Cited
U.S. Patent Documents
5597034 January 28, 1997 Barker et al.
D441724 May 8, 2001 Chou et al.
D441725 May 8, 2001 Chou et al.
D442565 May 22, 2001 Chou et al.
D442566 May 22, 2001 Chou et al.
D450306 November 13, 2001 Lin et al.
6407919 June 18, 2002 Chou
6418020 July 9, 2002 Lin
D464939 October 29, 2002 Chuang et al.
D476958 July 8, 2003 Tsai
6671172 December 30, 2003 Carter et al.
D501450 February 1, 2005 Watanabe et al.
6927979 August 9, 2005 Watanabe et al.
D509483 September 13, 2005 Watanabe et al.
D511326 November 8, 2005 Watanabe et al.
Patent History
Patent number: D537418
Type: Grant
Filed: Dec 23, 2003
Date of Patent: Feb 27, 2007
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Masayuki Iijima (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Selina Sikder
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/196,217
Classifications
Current U.S. Class: Heat Sink (D13/179)