Semiconductor module

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Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
U.S. Patent Documents
D318461 July 23, 1991 Hasegawa et al.
5994772 November 30, 1999 Shin
6127729 October 3, 2000 Fukuda
6373447 April 16, 2002 Rostoker et al.
6781239 August 24, 2004 Yegnashankaran et al.
6836002 December 28, 2004 Chikawa et al.
6992395 January 31, 2006 Fukasawa
20060043544 March 2, 2006 Tsukamoto et al.
20060097374 May 11, 2006 Egawa
20060131715 June 22, 2006 Satou et al.
Patent History
Patent number: D540272
Type: Grant
Filed: Sep 22, 2005
Date of Patent: Apr 10, 2007
Assignee: Murata Manufacturing Co., Ltd.
Inventor: Kazuaki Higashibata (Yasu)
Primary Examiner: Selina Sikder
Attorney: Dickstein, Shapiro, LLP.
Application Number: 29/238,804