Electronic module
Latest Harris Corporation Patents:
- Method for making a metal isolator body and associated device including the same
- Method for making a three-dimensional liquid crystal polymer electronic device
- Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air
- Method for making an optical fiber device from a 3D printed preform body and related structures
- Satellite with a thermal switch and associated methods
Description
The broken lines depict unclaimed environmental subject matter.
Claims
The ornamental design for a electronic module, as shown and described.
Referenced Cited
U.S. Patent Documents
| D193178 | July 1962 | Meldell |
| D203271 | December 1965 | Camp |
| D230566 | March 1974 | Harrell |
| D404721 | January 26, 1999 | Tennefoss et al. |
| D447395 | September 4, 2001 | Hurford |
| D456772 | May 7, 2002 | Grant et al. |
| 20070094508 | April 26, 2007 | Palum et al. |
Patent History
Patent number: D553586
Type: Grant
Filed: Oct 27, 2005
Date of Patent: Oct 23, 2007
Assignee: Harris Corporation (Melbourne, FL)
Inventors: William R. Devenish, III (Ontario, NY), Joshua Storm Gannon (Fairport, NY), Joe Scippo (Rochester, NY)
Primary Examiner: Louis S. Zarfas
Assistant Examiner: Anna K Dworzecka
Attorney: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
Application Number: 29/241,412
Type: Grant
Filed: Oct 27, 2005
Date of Patent: Oct 23, 2007
Assignee: Harris Corporation (Melbourne, FL)
Inventors: William R. Devenish, III (Ontario, NY), Joshua Storm Gannon (Fairport, NY), Joe Scippo (Rochester, NY)
Primary Examiner: Louis S. Zarfas
Assistant Examiner: Anna K Dworzecka
Attorney: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
Application Number: 29/241,412
Classifications