Electrical contact for use in a plating apparatus
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Description
Claims
The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D296547 | July 5, 1988 | Sachs |
5043528 | August 27, 1991 | Mohr |
D354268 | January 10, 1995 | Siemon et al. |
6534706 | March 18, 2003 | Rapp et al. |
6830667 | December 14, 2004 | Yamamoto |
D519931 | May 2, 2006 | Van Haaster |
7170013 | January 30, 2007 | Lewis |
2005-029863 | February 2005 | JP |
Patent History
Patent number: D555595
Type: Grant
Filed: Jan 3, 2007
Date of Patent: Nov 20, 2007
Assignee: Ebara Corporation (Tokyo)
Inventors: Mitsutoshi Yahagi (Tokyo), Kenichi Abe (Tokyo), Yuji Araki (Tokyo)
Primary Examiner: Daniel Bui
Attorney: Wenderoth, Lind & Ponack, L.L.P.
Application Number: 29/270,692
Type: Grant
Filed: Jan 3, 2007
Date of Patent: Nov 20, 2007
Assignee: Ebara Corporation (Tokyo)
Inventors: Mitsutoshi Yahagi (Tokyo), Kenichi Abe (Tokyo), Yuji Araki (Tokyo)
Primary Examiner: Daniel Bui
Attorney: Wenderoth, Lind & Ponack, L.L.P.
Application Number: 29/270,692
Classifications
Current U.S. Class:
Ring Or Spade Lug (D13/148)