Printed circuit board
Description
Claims
The ornamental design for a printed circuit board, as shown and described.
Referenced Cited
U.S. Patent Documents
| 4715928 | December 29, 1987 | Hamby |
| 4876120 | October 24, 1989 | Belke et al. |
| 5008496 | April 16, 1991 | Schmidt et al. |
| 5121297 | June 9, 1992 | Haas |
| D440209 | April 10, 2001 | Kang |
| D442149 | May 15, 2001 | Kang |
| D442567 | May 22, 2001 | Kang |
| 6936916 | August 30, 2005 | Moxham et al. |
| 20020131253 | September 19, 2002 | Kobayashi |
| 20030081393 | May 1, 2003 | Yokoyama |
Patent History
Patent number: D556158
Type: Grant
Filed: Mar 8, 2006
Date of Patent: Nov 27, 2007
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Xiang-Jian Kong (Shenzhen)
Primary Examiner: Selina Sikder
Attorney: Jeffrey T. Knapp
Application Number: 29/255,524
Type: Grant
Filed: Mar 8, 2006
Date of Patent: Nov 27, 2007
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Xiang-Jian Kong (Shenzhen)
Primary Examiner: Selina Sikder
Attorney: Jeffrey T. Knapp
Application Number: 29/255,524
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)