Electrical contact for use in a plating apparatus

- Ebara Corporation
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Description

FIG. 1 is a perspective view of an electrical contact for use in a plating apparatus in accordance with the present design;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

Claims

The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
D296547 July 5, 1988 Sachs
5043528 August 27, 1991 Mohr
D354268 January 10, 1995 Siemon et al.
6534706 March 18, 2003 Rapp et al.
6830667 December 14, 2004 Yamamoto
D519931 May 2, 2006 Van Haaster
7170013 January 30, 2007 Lewis
Foreign Patent Documents
2005-029863 February 2005 JP
Patent History
Patent number: D556692
Type: Grant
Filed: Jan 3, 2007
Date of Patent: Dec 4, 2007
Assignee: Ebara Corporation (Tokyo)
Inventors: Mitsutoshi Yahagi (Tokyo), Kenichi Abe (Tokyo), Yuji Araki (Tokyo)
Primary Examiner: Daniel Bui
Attorney: Wenderoth, Lind & Ponack, L.L.P.
Application Number: 29/270,693
Classifications
Current U.S. Class: Ring Or Spade Lug (D13/148)