Laser cutting machine

- Bystronic Laser AG
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Description

FIG. 1 is a perspective view of a laser cutting machine according to my new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a left side elevation view thereof; and,

FIG. 6 is a right side elevation view thereof.

The broken lines shown herein are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a laser cutting machine, as shown and described.

Referenced Cited
U.S. Patent Documents
D332615 January 19, 1993 Fang et al.
5183993 February 2, 1993 Sato et al.
5227606 July 13, 1993 Weeks et al.
D419573 January 25, 2000 Kawahara et al.
6140606 October 31, 2000 Heikilla et al.
6392192 May 21, 2002 Cole et al.
D464363 October 15, 2002 Saito et al.
6462301 October 8, 2002 Scott et al.
6476348 November 5, 2002 Grimes
6855911 February 15, 2005 Lai
20030106880 June 12, 2003 Lai
20050072767 April 7, 2005 Leibinger et al.
Patent History
Patent number: D557295
Type: Grant
Filed: Mar 26, 2007
Date of Patent: Dec 11, 2007
Assignee: Bystronic Laser AG (Niederonz)
Inventor: Karel Formanek (Solothurn)
Primary Examiner: Antoine D. Davis
Assistant Examiner: Patricia Palasik
Attorney: Alston & Bird LLP
Application Number: 29/278,313
Classifications
Current U.S. Class: Cutting (6) (D15/127)