Heat dissipation device
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Description
Claims
The ornamental design for a heat dissipation device, as shown and described.
Referenced Cited
U.S. Patent Documents
6860321 | March 1, 2005 | Ji-Hai et al. |
6942020 | September 13, 2005 | Chen et al. |
7068512 | June 27, 2006 | Lee et al. |
20050056400 | March 17, 2005 | Chen et al. |
20050247437 | November 10, 2005 | Ying et al. |
20060070721 | April 6, 2006 | Chen |
20060082972 | April 20, 2006 | Kim |
20060102324 | May 18, 2006 | Mok et al. |
Patent History
Patent number: D573112
Type: Grant
Filed: Sep 3, 2007
Date of Patent: Jul 15, 2008
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Hong-Bo Xu (Shenzhen)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/284,195
Type: Grant
Filed: Sep 3, 2007
Date of Patent: Jul 15, 2008
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Hong-Bo Xu (Shenzhen)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/284,195
Classifications
Current U.S. Class:
Heat Sink (D13/179)