Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof, showing a cooling fan being mounted to the heat dissipation device, wherein the cooling fan is shown in broken lines for illustrative environmental purposes only and forms no part of the claimed design.

Claims

The ornamental design for a heat dissipation device, as shown and described.

Referenced Cited
U.S. Patent Documents
6860321 March 1, 2005 Ji-Hai et al.
6942020 September 13, 2005 Chen et al.
7068512 June 27, 2006 Lee et al.
20050056400 March 17, 2005 Chen et al.
20050247437 November 10, 2005 Ying et al.
20060070721 April 6, 2006 Chen
20060082972 April 20, 2006 Kim
20060102324 May 18, 2006 Mok et al.
Patent History
Patent number: D573112
Type: Grant
Filed: Sep 3, 2007
Date of Patent: Jul 15, 2008
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Hong-Bo Xu (Shenzhen)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/284,195
Classifications
Current U.S. Class: Heat Sink (D13/179)