Chip

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Description

FIG. 1 is a perspective view of a new chip design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a chip, as shown and described.

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Patent History
Patent number: D578536
Type: Grant
Filed: Feb 27, 2008
Date of Patent: Oct 14, 2008
Assignee: Podium Photonics (Guangzhou) Ltd. (Guangzhou, Guangdong Province)
Inventors: Leo Lei (Guangzhou), Raymond Wang (Guangzhou)
Primary Examiner: Melanie Tung
Assistant Examiner: Susan Moon Lee
Attorney: Rader, Fishman & Grauer, PLLC
Application Number: 29/304,268