Microcontroller enclosure housing
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Description
The broken line portion of the figure drawings is included to show unclaimed subject matter only and forms no part of the claimed design.
Claims
We claim the ornamental design for a microcontroller enclosure housing, as shown and described.
Referenced Cited
U.S. Patent Documents
D327880 | July 14, 1992 | Lou |
D330704 | November 3, 1992 | Wagner |
D331395 | December 1, 1992 | Lou |
5178556 | January 12, 1993 | Chen |
D332938 | February 2, 1993 | Lambert, II et al. |
D339116 | September 7, 1993 | Gates et al. |
D367039 | February 13, 1996 | Loh |
5716228 | February 10, 1998 | Chen |
D411827 | July 6, 1999 | Gilliland et al. |
D430542 | September 5, 2000 | Hoferitza et al. |
D477814 | July 29, 2003 | Droulin et al. |
D494544 | August 17, 2004 | Dulai et al. |
D526614 | August 15, 2006 | Kajiura |
D553571 | October 23, 2007 | Carpenter et al. |
Patent History
Patent number: D579877
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,833
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,833
Classifications