Microcontroller enclosure housing

- Sauer-Danfoss Inc.
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Description

FIG. 1 is a front, top and right side perspective view of a microcontroller enclosure housing showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line portion of the figure drawings is included to show unclaimed subject matter only and forms no part of the claimed design.

Claims

We claim the ornamental design for a microcontroller enclosure housing, as shown and described.

Referenced Cited
U.S. Patent Documents
D327880 July 14, 1992 Lou
D330704 November 3, 1992 Wagner
D331395 December 1, 1992 Lou
5178556 January 12, 1993 Chen
D332938 February 2, 1993 Lambert, II et al.
D339116 September 7, 1993 Gates et al.
D367039 February 13, 1996 Loh
5716228 February 10, 1998 Chen
D411827 July 6, 1999 Gilliland et al.
D430542 September 5, 2000 Hoferitza et al.
D477814 July 29, 2003 Droulin et al.
D494544 August 17, 2004 Dulai et al.
D526614 August 15, 2006 Kajiura
D553571 October 23, 2007 Carpenter et al.
Patent History
Patent number: D579877
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,833