Microcontroller enclosure housing
Description
The broken lines showing the of environment is for illustrative purposes only and forms no part of the claim design.
Claims
The ornamental design for a microcontroller enclosure housing, as shown and described.
Referenced Cited
U.S. Patent Documents
| D327880 | July 14, 1992 | Lou |
| D330704 | November 3, 1992 | Wagner |
| D331395 | December 1, 1992 | Lou |
| 5178556 | January 12, 1993 | Chen |
| D332938 | February 2, 1993 | Lambert, II et al. |
| D339116 | September 7, 1993 | Gates et al. |
| D367039 | February 13, 1996 | Loh |
| 5716228 | February 10, 1998 | Chen |
| D411827 | July 6, 1999 | Gilliland et al. |
| D430542 | September 5, 2000 | Hoferitza et al. |
| D477814 | July 29, 2003 | Droulin et al. |
| D494544 | August 17, 2004 | Dulai et al. |
| D524614 | July 11, 2006 | Kajiura |
| D553571 | October 23, 2007 | Carpenter et al. |
Patent History
Patent number: D579878
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,835
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,835
Classifications