Microcontroller enclosure housing
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Description
The broken lines showing the of environment is for illustrative purposes only and forms no part of the claim design.
Claims
The ornamental design for a microcontroller enclosure housing, as shown and described.
Referenced Cited
U.S. Patent Documents
D327880 | July 14, 1992 | Lou |
D330704 | November 3, 1992 | Wagner |
D331395 | December 1, 1992 | Lou |
5178556 | January 12, 1993 | Chen |
D332938 | February 2, 1993 | Lambert, II et al. |
D339116 | September 7, 1993 | Gates et al. |
D367039 | February 13, 1996 | Loh |
5716228 | February 10, 1998 | Chen |
D411827 | July 6, 1999 | Gilliland et al. |
D430542 | September 5, 2000 | Hoferitza et al. |
D477814 | July 29, 2003 | Droulin et al. |
D494544 | August 17, 2004 | Dulai et al. |
D524614 | July 11, 2006 | Kajiura |
D553571 | October 23, 2007 | Carpenter et al. |
Patent History
Patent number: D579878
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,835
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Nov 4, 2008
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel D Bui
Application Number: 29/281,835
Classifications