Heater for manufacturing semiconductor
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Description
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a heater for manufacturing semiconductor or the like, as shown and described.
Referenced Cited
U.S. Patent Documents
| 5540782 | July 30, 1996 | Miyagi et al. |
| 5911896 | June 15, 1999 | Holden et al. |
| 6037574 | March 14, 2000 | Lanham et al. |
| D427570 | July 4, 2000 | Ishii |
| D428858 | August 1, 2000 | Ishii |
| 6529686 | March 4, 2003 | Ramanan et al. |
| 6616767 | September 9, 2003 | Zhao et al. |
| 20020190051 | December 19, 2002 | Wang et al. |
| 20040149716 | August 5, 2004 | Inagawa et al. |
| 20050217583 | October 6, 2005 | Cole et al. |
| 20070166146 | July 19, 2007 | Sekiya |
Patent History
Patent number: D601521
Type: Grant
Filed: Mar 28, 2007
Date of Patent: Oct 6, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Tomohito Komatsu (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Application Number: 29/278,403
Type: Grant
Filed: Mar 28, 2007
Date of Patent: Oct 6, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Tomohito Komatsu (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Application Number: 29/278,403
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)