Housing of a light emitting diode package
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The claimed housing of a light emitting diode package includes a pair of leads. Both of the leads extend toward the rear side of the housing through two opposite sides of the housing and are not protruding out of the outer surfaces of the housing. Therefore, the housing is not only suitable for being used in a side view light emitting diode package but a top view light emitting diode package.
Claims
The ornamental design for a housing of a light emitting diode package, as shown and described.
Type: Grant
Filed: Apr 3, 2008
Date of Patent: Oct 20, 2009
Assignee: Everlight Electronics Co., Ltd. (Taipei)
Inventors: Chung-Han Sheng (Banciao), Yi-Wen Chen (Banciao)
Primary Examiner: Selina Sikder
Attorney: Jianq Chyun IP Office
Application Number: 29/306,131