Housing of a light emitting diode package

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Description

FIG. 1 is a perspective view of a housing of a light emitting diode package showing the new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof wherein the broken line showing portion of the LED is for illustrative purpose only and forms no part of the claimed design;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.

The claimed housing of a light emitting diode package includes a pair of leads. Both of the leads extend toward the rear side of the housing through two opposite sides of the housing and are not protruding out of the outer surfaces of the housing. Therefore, the housing is not only suitable for being used in a side view light emitting diode package but a top view light emitting diode package.

Claims

The ornamental design for a housing of a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D528999 September 26, 2006 Cho et al.
D537798 March 6, 2007 Shin et al.
D558156 December 25, 2007 Yoon et al.
D578491 October 14, 2008 Lee et al.
D593515 June 2, 2009 Nakagawa
Foreign Patent Documents
D1261967 February 2006 JP
D1288463 December 2006 JP
575349 February 2004 TW
Patent History
Patent number: D602447
Type: Grant
Filed: Apr 3, 2008
Date of Patent: Oct 20, 2009
Assignee: Everlight Electronics Co., Ltd. (Taipei)
Inventors: Chung-Han Sheng (Banciao), Yi-Wen Chen (Banciao)
Primary Examiner: Selina Sikder
Attorney: Jianq Chyun IP Office
Application Number: 29/306,131
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)