Abstract: A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface.

Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Abstract: Provided are a light guiding element (100), a light guiding device (500), and a lighting module (800). The light guiding element (100) includes a light incident portion (1) and a light exit portion (2), where the light incident portion (1) includes a plurality of light guiding columns (11), each of which includes a first end surface (A) connected to the light exit portion (2), a second end surface (B) facing away from the light exit portion, and a side surface formed between the first end surface (A) and the second end surface (B), where the first end surface (A) has an area larger than that of the second end surface (B). Also provided are a light guiding device (500) including the light guiding element (100), and a lighting module (800) including the light guiding device (500). The light guiding element (100) enables, for a generated light type pattern, the shape to be complete, the color to be even, and the phenomena of vignette effect and dark lines to be reduced.

Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.

Abstract: An illumination apparatus for vehicle is disclosed, which includes an illumination module and a microcontroller. The illumination module includes a circuit base and an LED array which is disposed on the circuit base and includes a plurality of LED packages. Each of the LED packages includes a driver chip, a light source and a packaging structure, in which the driver chip and the light source are disposed. The driver chip is electrically connected to the light source to drive the light source to emit lights. The microcontroller is electrically connected to the LED packages to control the operation of the LED packages. Therefore, lights emitted from the LED packages can form a dynamic or static image; moreover, the light source (LED chip) and the driver chip are in the same packaging structure, so the circuit layout of the circuit base can be simplified.

Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

Abstract: A lighting device is disclosed, including an LED die, a light-transmissive encapsulant and a light-transmissive wall. The light-transmissive encapsulant covers the light-emitting side surfaces and the top surface, and the light-transmissive wall surrounds the light-transmissive encapsulant and covers the side surfaces of the light-transmissive encapsulant. Furthermore, the refractive index of the light-transmissive encapsulant is not greater than the refractive index of the light-transmissive wall. A lighting module is further disclosed, including a circuit substrate and the lighting devices, as described above, which are disposed on the circuit substrate. Therefore, when lights generated from the LED die are transmitted into the light-transmissive wall from the light-transmissive encapsulant, the lights will be deflected towards the lateral direction, thereby increasing the viewing angle of the lighting device.

Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Abstract: A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: Provided are a light guiding element (100), a light guiding device (500), and a lighting module (800). The light guiding element (100) includes a light incident portion (1) and a light exit portion (2), where the light incident portion (1) includes a plurality of light guiding columns (11), each of which includes a first end surface (A) connected to the light exit portion (2), a second end surface (B) facing away from the light exit portion, and a side surface formed between the first end surface (A) and the second end surface (B), where the first end surface (A) has an area larger than that of the second end surface (B). Also provided are a light guiding device (500) including the light guiding element (100), and a lighting module (800) including the light guiding device (500). The light guiding element (100) enables, for a generated light type pattern, the shape to be complete, the color to be even, and the phenomena of vignette effect and dark lines to be reduced.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: An LED lamp and a component, a heat dissipating base and an LED wireless dimming system thereof are provided. The LED lamp component comprises a heat dissipating base, a light emitting module and a lens, the heat dissipating base has a bearing surface and a back surface opposite to the bearing surface, the bearing surface is provided with a first recessed section therein, the back surface is provided with heat dissipating structures; the heat dissipating base further comprises a first joint portion; the light emitting module is disposed in the first recessed section, and the lens covering the light emitting module.

Abstract: A light emitting diode package structure including a base, a light emitting diode and an encapsulant is provided. The light emitting diode is disposed on a surface of the base and is adapted to generate and emit a light. The encapsulant is disposed on the base and encapsulates the light emitting diode. The encapsulant has a surface parallel to the surface of the base and a plurality of surfaces perpendicular to the surface of the base. The light, after passing through the surface of the encapsulant parallel to the surface of the base, has a first light intensity. The light, after passing through the surfaces of the encapsulant perpendicular to the surface of the base, has a second light intensity. The first light intensity is greater than the second light intensity. In addition, a manufacturing method of a light emitting diode package structure is also provided.

Abstract: The present invention provides a light emitting apparatus and a lighting module, comprising: a circuit substrate, a plurality of optical sources and an optical element; the optical element comprises a translucent element and an interference element; the plurality of light sources are arranged on the circuit substrate for lighting the optical element; the optical element is arranged above the plurality of light sources; and the interference element is arranged on the translucent element, which is used to make light emitted from each of the light sources offset interference in a first polarization direction, enhance interference in a second polarization direction, and emit through the translucent element. The light emitting apparatus and the lighting module of the present invention are employed to provide a more diversified optical pattern to the user and improve the user experience.

Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.