Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines shown in the figures are included for the purpose of illustrating portions of the heat dissipation device that form no part of the claimed design.

Claims

The ornamental design for a heat dissipation device, as shown and described.

Referenced Cited
U.S. Patent Documents
D475354 June 3, 2003 Wang
20050133199 June 23, 2005 Lo
20070095508 May 3, 2007 Xia et al.
20070295488 December 27, 2007 Fielding et al.
20080017350 January 24, 2008 Hwang et al.
20090009969 January 8, 2009 Chu
20090056918 March 5, 2009 Li et al.
Patent History
Patent number: D604705
Type: Grant
Filed: Sep 15, 2008
Date of Patent: Nov 24, 2009
Assignee: Foxconn Technology Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Yi-Qiang Wu (Shenzhen), Chun-Chi Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/324,573
Classifications
Current U.S. Class: Heat Sink (D13/179)