Heat dissipation device
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Description
The broken lines shown in the figures are included for the purpose of illustrating portions of the heat dissipation device that form no part of the claimed design.
Claims
The ornamental design for a heat dissipation device, as shown and described.
Referenced Cited
U.S. Patent Documents
D475354 | June 3, 2003 | Wang |
20050133199 | June 23, 2005 | Lo |
20070095508 | May 3, 2007 | Xia et al. |
20070295488 | December 27, 2007 | Fielding et al. |
20080017350 | January 24, 2008 | Hwang et al. |
20090009969 | January 8, 2009 | Chu |
20090056918 | March 5, 2009 | Li et al. |
Patent History
Patent number: D604705
Type: Grant
Filed: Sep 15, 2008
Date of Patent: Nov 24, 2009
Assignee: Foxconn Technology Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Yi-Qiang Wu (Shenzhen), Chun-Chi Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/324,573
Type: Grant
Filed: Sep 15, 2008
Date of Patent: Nov 24, 2009
Assignee: Foxconn Technology Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Yi-Qiang Wu (Shenzhen), Chun-Chi Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/324,573
Classifications
Current U.S. Class:
Heat Sink (D13/179)