Heat dissipating unit

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Description

FIG. 1 is a perspective view of a heat dissipating unit showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line showing of portion of the heat dissipating unit is for illustrative purpose only and forms no part of the claimed design.

Claims

The ornamental design for a heat dissipating unit, as shown and described.

Referenced Cited
U.S. Patent Documents
6330908 December 18, 2001 Lee et al.
6557626 May 6, 2003 O'Sullivan et al.
D481688 November 4, 2003 Lee et al.
7038913 May 2, 2006 Lee et al.
20040226690 November 18, 2004 Lee et al.
20060060332 March 23, 2006 Wang et al.
20070253202 November 1, 2007 Wu et al.
Patent History
Patent number: D606502
Type: Grant
Filed: Oct 27, 2008
Date of Patent: Dec 22, 2009
Assignees: Shanghai Sansi Technology Co., Ltd (Shanghai), Shanghai Sansi Electronics Engineering Co., Ltd (Shanghai)
Inventors: Bishou Chen (Shanghai), Yinghua Wang (Shanghai), Peng Wang (Shanghai), Sheng Li (Shanghai), Xiaodong Gu (Shanghai)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/326,900
Classifications
Current U.S. Class: Heat Sink (D13/179)