Heat dissipating unit
Description
The broken line showing of portion of the heat dissipating unit is for illustrative purpose only and forms no part of the claimed design.
Claims
The ornamental design for a heat dissipating unit, as shown and described.
Referenced Cited
U.S. Patent Documents
| 6330908 | December 18, 2001 | Lee et al. |
| 6557626 | May 6, 2003 | O'Sullivan et al. |
| D481688 | November 4, 2003 | Lee et al. |
| 7038913 | May 2, 2006 | Lee et al. |
| 20040226690 | November 18, 2004 | Lee et al. |
| 20060060332 | March 23, 2006 | Wang et al. |
| 20070253202 | November 1, 2007 | Wu et al. |
Patent History
Patent number: D606502
Type: Grant
Filed: Oct 27, 2008
Date of Patent: Dec 22, 2009
Assignees: Shanghai Sansi Technology Co., Ltd (Shanghai), Shanghai Sansi Electronics Engineering Co., Ltd (Shanghai)
Inventors: Bishou Chen (Shanghai), Yinghua Wang (Shanghai), Peng Wang (Shanghai), Sheng Li (Shanghai), Xiaodong Gu (Shanghai)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/326,900
Type: Grant
Filed: Oct 27, 2008
Date of Patent: Dec 22, 2009
Assignees: Shanghai Sansi Technology Co., Ltd (Shanghai), Shanghai Sansi Electronics Engineering Co., Ltd (Shanghai)
Inventors: Bishou Chen (Shanghai), Yinghua Wang (Shanghai), Peng Wang (Shanghai), Sheng Li (Shanghai), Xiaodong Gu (Shanghai)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/326,900
Classifications
Current U.S. Class:
Heat Sink (D13/179)