Earphone

- Sony Corporation
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Description

FIG. 1 is a front right top perspective view of a first embodiment of an earphone showing our new design;

FIG. 2 is a rear right top perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof;

FIG. 6 is an opposite side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front right top perspective view of a second embodiment of an earphone showing our new design;

FIG. 10 is a rear right top perspective view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is a front right top perspective view of a third embodiment of an earphone showing our new design;

FIG. 18 is a front elevational view thereof;

FIG. 19 is a rear elevational view thereof;

FIG. 20 is a left side elevational view thereof;

FIG. 21 is a right side elevational view thereof;

FIG. 22 is a top plan view thereof;

FIG. 23 is a bottom plan view thereof;

FIG. 24 is a front right top perspective view of a fourth embodiment of an earphone showing our new design;

FIG. 25 is a front elevational view thereof;

FIG. 26 is a rear elevational view thereof;

FIG. 27 is a left side elevational view thereof;

FIG. 28 is a right side elevational view thereof;

FIG. 29 is a top plan view thereof;

FIG. 30 is a bottom plan view thereof;

FIG. 31 is a front right top perspective view of a fifth embodiment of an earphone showing our new design;

FIG. 32 is a front elevational view thereof;

FIG. 33 is a rear elevational view thereof;

FIG. 34 is a left side elevational view thereof;

FIG. 35 is a right side elevational view thereof;

FIG. 36 is a top plan view thereof;

FIG. 37 is a bottom plan view thereof;

FIG. 38 is a front right top perspective view of a sixth embodiment of an earphone showing our new design;

FIG. 39 is a front elevational view thereof;

FIG. 40 is a rear elevational view thereof;

FIG. 41 is a left side elevational view thereof;

FIG. 42 is a right side elevational view thereof;

FIG. 43 is a top plan view thereof;

FIG. 44 is a bottom plan view thereof;

FIG. 45 is a front right top perspective view of a seventh embodiment of an earphone showing our new design;

FIG. 46 is a rear right top perspective view thereof;

FIG. 47 is a front elevational view thereof;

FIG. 48 is a rear elevational view thereof;

FIG. 49 is a left side elevational view thereof;

FIG. 50 is a right side elevational view thereof;

FIG. 51 is a top plan view thereof; and,

FIG. 52 is a bottom plan view thereof.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for an earphone, as shown and described.

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Patent History
Patent number: D610129
Type: Grant
Filed: Dec 31, 2008
Date of Patent: Feb 16, 2010
Assignee: Sony Corporation (Tokyo)
Inventors: Keiko Densho (Tokyo), Yosuke Shimizu (Tokyo), Naoki Sugiyama (Tokyo), Naoto Shimizu (Tokyo), So Morimoto (Tokyo), Sohei Kitayama (Tokyo)
Primary Examiner: Paula Greene
Attorney: Rader, Fishman & Grauer, PLLC
Application Number: 29/311,145
Classifications
Current U.S. Class: Headphone (D14/223)