Circuit board module

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Description

FIG. 1 is a perspective view of a circuit board module showing my new design;

FIG. 2 is a front view of a circuit board module;

FIG. 3 is a left view of a circuit board module;

FIG. 4 is a right view of a circuit board module; and,

FIG. 5 is a top view of a circuit board module.

Claims

The ornamental design for a circuit board module, as shown and described.

Referenced Cited
U.S. Patent Documents
6232560 May 15, 2001 Lin
6609915 August 26, 2003 Adams et al.
D531139 October 31, 2006 Egawa et al.
D552566 October 9, 2007 Moriyama
7435097 October 14, 2008 Mecker
20060072293 April 6, 2006 Peele
20070097656 May 3, 2007 Sakai
20080088597 April 17, 2008 Prest et al.
20080142352 June 19, 2008 Wright
20090051647 February 26, 2009 Su et al.
Patent History
Patent number: D611014
Type: Grant
Filed: Jun 13, 2008
Date of Patent: Mar 2, 2010
Assignee: (Taipei)
Inventor: Kuo-An Huang (Shihlin District, Taipei)
Primary Examiner: Selina Sikder
Attorney: WPAT., P.C.
Application Number: 29/319,715