Heat dissipation device
Description
Claims
The ornamental design for a heat dissipation device, as shown and described.
Referenced Cited
U.S. Patent Documents
D268666 | April 19, 1983 | Moore |
D298458 | November 8, 1988 | Margolin et al. |
4918571 | April 17, 1990 | Grabbe |
5579827 | December 3, 1996 | Chung |
5708564 | January 13, 1998 | Lin |
5825622 | October 20, 1998 | Rife et al. |
6550531 | April 22, 2003 | Searls et al. |
7172017 | February 6, 2007 | Tan et al. |
D592614 | May 19, 2009 | Plonski et al. |
Patent History
Patent number: D616381
Type: Grant
Filed: Sep 29, 2009
Date of Patent: May 25, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Hsueh-Chen Chang (Miao-Li Hisen), Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/344,388
Type: Grant
Filed: Sep 29, 2009
Date of Patent: May 25, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Hsueh-Chen Chang (Miao-Li Hisen), Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/344,388
Classifications
Current U.S. Class:
Heat Sink (D13/179)