Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown.

Referenced Cited
U.S. Patent Documents
D285301 August 26, 1986 Johnson
5574626 November 12, 1996 Smith
D402025 December 1, 1998 Dodson
6295202 September 25, 2001 Tucker et al.
6343014 January 29, 2002 Lin
20030183373 October 2, 2003 Sarraf et al.
20040104021 June 3, 2004 Kujirai
20070272400 November 29, 2007 Abul-Haj et al.
20090139690 June 4, 2009 Maerz et al.
Patent History
Patent number: D618184
Type: Grant
Filed: Sep 29, 2009
Date of Patent: Jun 22, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Hsueh-Chen Chang (Miao-Li Hsien), Yu-Shu Chen (Miao-Li Hsien), Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/344,383
Classifications
Current U.S. Class: Heat Sink (D13/179)