Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown.

Referenced Cited
U.S. Patent Documents
6637502 October 28, 2003 North et al.
6735864 May 18, 2004 Sato et al.
6899164 May 31, 2005 Li et al.
7152666 December 26, 2006 Chen et al.
D581376 November 25, 2008 Shaner
7509995 March 31, 2009 Bhatti et al.
20030070790 April 17, 2003 Chen et al.
20090139690 June 4, 2009 Maerz et al.
Patent History
Patent number: D618631
Type: Grant
Filed: Jul 8, 2009
Date of Patent: Jun 29, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: An-Chi Wei (Miao-Li Hsien), Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/339,854
Classifications
Current U.S. Class: Heat Sink (D13/179)