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Claims
The ornamental design of a package, as shown and described.
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Type: Grant
Filed: Dec 22, 2006
Date of Patent: Aug 17, 2010
Assignee: Coby Electronics Corporation (Lake Success, NY)
Inventors: Juan Benet (Carmel, NY), Cheolsoon Jang (New York, NY), Johann Lee (Maspeth, NY)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Derrick Holland
Attorney: Mayer Brown LLP
Application Number: 29/275,417