LED package structure

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Description

FIG. 1 is a perspective view of a “LED package structure” showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines define portions of the LED package that form no part of the claimed design.

Claims

The ornamental design for a “LED package structure,” as shown and described.

Referenced Cited
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Patent History
Patent number: D624885
Type: Grant
Filed: Jan 27, 2010
Date of Patent: Oct 5, 2010
Assignees: Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou), Lite-On Technology Corporation (Taipei)
Inventors: Chen-Hsiu Lin (Tucheng), Chih-Chiang Kao (Kaohsiung)
Primary Examiner: Selina Sikder
Attorney: Rabin & Berdo, P.C.
Application Number: 29/354,644
Classifications