Package of a light emitting diode

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Description

FIG. 1 is a perspective view of a package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The portions shown in dashed lines do not form part of the design.

Claims

The ornamental design for a package of a light emitting diode, as shown and described.

Referenced Cited
U.S. Patent Documents
6683370 January 27, 2004 McDonald et al.
D559804 January 15, 2008 Lee
D566055 April 8, 2008 Kim
D580891 November 18, 2008 Sung et al.
D595674 July 7, 2009 Wang et al.
D597968 August 11, 2009 Kobayakawa et al.
D599750 September 8, 2009 Kim et al.
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20060208271 September 21, 2006 Kim et al.
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Patent History
Patent number: D626096
Type: Grant
Filed: Jan 29, 2010
Date of Patent: Oct 26, 2010
Assignees: Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou), Lite-On Technology Corp. (Taipei)
Inventors: Tsung-Kang Ying (Taipei), Chung-Hsien Yu (Taipei)
Primary Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/354,861
Classifications