Package of a light emitting diode

- Lite-On Technology Corp.
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Description

FIG. 1 is a perspective view of package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The portions shown in dashed lines do not form part of the design.

Claims

The ornamental design for package of a light emitting diode, as shown and described.

Referenced Cited
U.S. Patent Documents
D475028 May 27, 2003 Hori et al.
D475355 June 3, 2003 Hori et al.
D562272 February 19, 2008 Su et al.
D568834 May 13, 2008 Nishida et al.
D568835 May 13, 2008 Nishida et al.
D574791 August 12, 2008 Shimozawa
D590355 April 14, 2009 Tsuchiya et al.
D590357 April 14, 2009 Miyashita
D597500 August 4, 2009 Sung et al.
7714347 May 11, 2010 Chen et al.
20060163602 July 27, 2006 Isokawa
20070063213 March 22, 2007 Hsieh et al.
Patent History
Patent number: D627310
Type: Grant
Filed: Mar 2, 2010
Date of Patent: Nov 16, 2010
Assignee: Lite-On Technology Corp. (Taipei)
Inventors: Chen-Hsiu Lin (Taipei), Chia-Hao Wu (Taipei)
Primary Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/356,734
Classifications