Eject mechanism

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of an eject mechanism showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and

FIG. 8 is a front, top and right side perspective view showing the eject mechanism in use condition.

FIG. 9 is a front, top and right side perspective view of a second embodiment of an eject mechanism showing our new design;

FIG. 10 is a front elevational view thereof;

FIG. 11 is a rear elevational view thereof;

FIG. 12 is a left side elevational view thereof;

FIG. 13 is a right side elevational view thereof;

FIG. 14 is a top plan view thereof;

FIG. 15 is a bottom plan view thereof; and,

FIG. 16 is a front, top and right side perspective view showing the eject mechanism in use condition.

The broken line shown in the drawings is included for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims

The ornamental design for an eject mechanism, as shown and described.

Referenced Cited
U.S. Patent Documents
6419503 July 16, 2002 Choy
6551116 April 22, 2003 Liu
D491148 June 8, 2004 Zhao et al.
7207815 April 24, 2007 Ju
D599296 September 1, 2009 Guan et al.
D611426 March 9, 2010 Kuo
20070287309 December 13, 2007 McGrath et al.
Patent History
Patent number: D627740
Type: Grant
Filed: Jan 22, 2010
Date of Patent: Nov 23, 2010
Assignee: Hon Hai Precision Ind. Co., Ltd. (Taipei Hsien)
Inventors: Sheng-Yu Wu (Kunshan), Xue-Wu Bu (Kunshan), Ting-Shun Liu (Kunshan)
Primary Examiner: Daniel D Bui
Attorney: Wei Te Chung
Application Number: 29/354,292
Classifications
Current U.S. Class: Element Or Attachment (D13/154)