Light emitting diode packaging array

- Epistar Corporation
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Description

FIG. 1 is a perspective view of a light emitting diode packaging array showing the claimed design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken lines are provided for illustrative purpose only and form no part of the claimed design.

Claims

The ornamental design for a light emitting diode packaging array, as shown and described.

Referenced Cited
U.S. Patent Documents
D523825 June 27, 2006 Egawa
D528996 September 26, 2006 Egawa
D577690 September 30, 2008 Shida et al.
D584247 January 6, 2009 Sung et al.
D591695 May 5, 2009 Oh et al.
D603813 November 10, 2009 Nishimura et al.
Patent History
Patent number: D631019
Type: Grant
Filed: Apr 21, 2010
Date of Patent: Jan 18, 2011
Assignee: Epistar Corporation (Hsinchu)
Inventors: Alexander Chan Wang (Hsinchu), Chia-Liang Hsu (Hsinchu), Pang-Yen Liu (Hsinchu)
Primary Examiner: Selina Sikder
Attorney: Holland & Knight LLP
Application Number: 29/360,157
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)