Audio set
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
Description
The broken lines in the drawings are for illustrative purpose only and form no part of the claimed design.
Claims
The ornamental design for an audio set, as shown and described.
Referenced Cited
Patent History
Patent number: D633475
Type: Grant
Filed: Feb 11, 2010
Date of Patent: Mar 1, 2011
Assignee: Samsung Electronics Co., Ltd. (Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do)
Inventor: Ju-Won Cho (Seoul)
Primary Examiner: Nanda Bondade
Attorney: Lexyoume IP Group, PLLC.
Application Number: 29/348,764
Type: Grant
Filed: Feb 11, 2010
Date of Patent: Mar 1, 2011
Assignee: Samsung Electronics Co., Ltd. (Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do)
Inventor: Ju-Won Cho (Seoul)
Primary Examiner: Nanda Bondade
Attorney: Lexyoume IP Group, PLLC.
Application Number: 29/348,764
Classifications
Current U.S. Class:
Rectangular Or Square Projection Surface Or Outlet (D14/214)