Plug portion for a headphone

- Sony Corporation
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Description

FIG. 1 is a perspective view of a plug portion for a headphone showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a perspective view of another embodiment of a plug portion showing my new design;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a left side elevational view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof; and,

FIG. 14 is a bottom plan view thereof.

Portions in broken lines are for illustrative purposes only and form no part of claimed design. Dot-dash broken lines define boundaries of, but are not included in, the claimed design.

Claims

The ornamental design for a plug portion for a headphone, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D635574
Type: Grant
Filed: Mar 5, 2010
Date of Patent: Apr 5, 2011
Assignee: Sony Corporation (Tokyo)
Inventor: Rui Morisawa (Tokyo)
Primary Examiner: Paula Greene
Attorney: Rader, Fishman & Grauer PLLC
Application Number: 29/347,573