LED package base
Latest Harvatek Corporation Patents:
- Semiconductor device with high heat dissipation efficiency
- Light source assembly, optical sensor assembly, and method of manufacturing a cell of the same
- LED display screen module
- UV LED package structure for improving light extraction
- Light-emitting diode (LED) assembly and method of manufacturing an LED cell of the same
Description
Claims
The ornamental design for a “LED package base,” as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D659655
Type: Grant
Filed: Jun 26, 2011
Date of Patent: May 15, 2012
Assignee: Harvatek Corporation (Hsinchu)
Inventor: Bily Wang (Hsinchu)
Primary Examiner: Selina Sikder
Attorney: Li & Cai Intellectual Property (USA) Office
Application Number: 29/396,123
Type: Grant
Filed: Jun 26, 2011
Date of Patent: May 15, 2012
Assignee: Harvatek Corporation (Hsinchu)
Inventor: Bily Wang (Hsinchu)
Primary Examiner: Selina Sikder
Attorney: Li & Cai Intellectual Property (USA) Office
Application Number: 29/396,123
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)