Soldering tip
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Description
The portion shown by broken lines is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a soldering tip, as shown and described.
Referenced Cited
Patent History
Patent number: D660668
Type: Grant
Filed: Sep 11, 2011
Date of Patent: May 29, 2012
Assignee: Hakko Corporation (Osaka)
Inventor: Mitsuhiko Miyazaki (Osaka)
Primary Examiner: Philip S Hyder
Assistant Examiner: Roselynne Cody
Attorney: Squire Sanders (US) LLP
Application Number: 29/401,364
Type: Grant
Filed: Sep 11, 2011
Date of Patent: May 29, 2012
Assignee: Hakko Corporation (Osaka)
Inventor: Mitsuhiko Miyazaki (Osaka)
Primary Examiner: Philip S Hyder
Assistant Examiner: Roselynne Cody
Attorney: Squire Sanders (US) LLP
Application Number: 29/401,364
Classifications
Current U.S. Class:
D8/30