Substrate for LED package

- LG Electronics
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Description

FIG. 1 is a perspective view of the substrate for LED package showing our new design;

FIG. 2 is a front view thereof, the rear view being a mirror image thereof;

FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a cross-sectional reference view thereof through VI-VI of FIG. 2.

The broken lines shown are included for the purpose of illustrating the unclaimed portions of the article and form no part of the claim.

Claims

The ornamental design for a substrate for LED package, as shown and described.

Referenced Cited
U.S. Patent Documents
D634284 March 15, 2011 Ko et al.
D638378 May 24, 2011 Ko et al.
D645425 September 20, 2011 Lin et al.
D652808 January 24, 2012 Chang et al.
20070096114 May 3, 2007 Aoki et al.
20110127566 June 2, 2011 Yoon
20110241030 October 6, 2011 Kim
20120074451 March 29, 2012 Lin
Patent History
Patent number: D664110
Type: Grant
Filed: Nov 23, 2011
Date of Patent: Jul 24, 2012
Assignee: LG Innotek Co., Ltd. (Seoul)
Inventors: Bong Kul Min (Seoul), Gyu Hyeong Bak (Seoul)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/407,197
Classifications