Main housing for optical sub-assembly for transceivers

- EZConn Corporation
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Description

FIG. 1 is a top, front and right perspective view of a main housing for optical sub-assembly for transceivers showing my design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a top, front and left perspective view thereof.

The broken line showing of the main housing for the optical sub-assembly for transceivers is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims

The ornamental design for a main housing for optical sub-assembly for transceivers, as shown and described.

Referenced Cited
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Patent History
Patent number: D670750
Type: Grant
Filed: Nov 16, 2011
Date of Patent: Nov 13, 2012
Assignees: EZConn Corporation (Taipei), (Taipei)
Inventor: Chih-Cheng Chien (Taipei)
Primary Examiner: Paula Greene
Attorney: Rosenberg, Klein & Lee
Application Number: 29/406,542
Classifications