LED package

- LG Electronics
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Description

FIG. 1 is a perspective view of a LED package showing my/our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof, the right side being a mirror image;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a LED package, as shown and described.

Referenced Cited
U.S. Patent Documents
D524260 July 4, 2006 Ishizaka et al.
D573553 July 22, 2008 Uemoto et al.
D592162 May 12, 2009 Sugimoto et al.
D592615 May 19, 2009 Imai et al.
D615933 May 18, 2010 Ono et al.
D623607 September 14, 2010 Andrews et al.
D624887 October 5, 2010 Takahashi et al.
D629368 December 21, 2010 Chou
D649521 November 29, 2011 Lin
D650760 December 20, 2011 Hussell et al.
20090135581 May 28, 2009 Yano et al.
Patent History
Patent number: D673127
Type: Grant
Filed: Oct 25, 2011
Date of Patent: Dec 25, 2012
Assignee: LG Innotek Co., Ltd. (Seoul)
Inventors: Hyun Seok Cho (Seoul), Ji Min Park (Seoul)
Primary Examiner: Selina Sikder
Attorney: Lowe Hauptman Ham & Berner, LLP
Application Number: 29/404,719
Classifications