Wafer holding member
Latest Tokyo Electron Limited Patents:
- FLUID SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- PLASMA PROCESSING APPARATUS
- INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, INFORMATION PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM
Description
Claims
The ornamental design for wafer holding member, as shown and described.
Patent History
Patent number: D674366
Type: Grant
Filed: Jun 24, 2011
Date of Patent: Jan 15, 2013
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Hideki Kajiwara (Koshi)
Primary Examiner: Selina Sikder
Application Number: 29/396,050
Type: Grant
Filed: Jun 24, 2011
Date of Patent: Jan 15, 2013
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Hideki Kajiwara (Koshi)
Primary Examiner: Selina Sikder
Application Number: 29/396,050
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)