Adhesive tape for semiconductor manufacturing

Description

FIG. 1 is a top plan view of an adhesive tape for semiconductor manufacturing incorporating a first embodiment of our new design;

FIG. 2 is a bottom plan view of the adhesive tape of FIG. 1;

FIG. 3 is a rear side view of the adhesive tape of FIG. 1;

FIG. 4 is a front side view of the adhesive tape of FIG. 1;

FIG. 5 is a right side view of the adhesive tape of FIG. 1;

FIG. 6 is a left side view of the adhesive tape of FIG. 1;

FIG. 7 is a cross-sectional view taken at line VII-VII in FIG. 1;

FIG. 8 is a cross-sectional view taken at line VIII-VIII in FIG. 1;

FIG. 9 is an enlarged view of portion IX-IX in FIG. 7; and,

FIG. 10 is an enlarged view of portions X-X, XI-XI in FIG. 1.

The dashed line showing of the adhesive tape is for purposes of illustrating portions of the adhesive tape and forms no part of the claimed design.

The broken lines having alternating long and short segments define bounds of the claimed design and form no part thereof.

Claims

The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.