- Sony Corporation
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FIG. 1 is a perspective view of an earphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design.


The ornamental design for an earphone, as shown and described.

Patent History
Patent number: D682257
Type: Grant
Filed: Sep 13, 2012
Date of Patent: May 14, 2013
Assignee: Sony Corporation (Tokyo)
Inventors: Qi Zheng (Tokyo), Rui Morisawa (Tokyo), Tomotsugu Minamikawa (Tokyo), Jun Komiyama (Tokyo), Taichi Nokuo (Tokyo)
Primary Examiner: Paula Greene
Application Number: 29/421,744
Current U.S. Class: Headphone (D14/223)