Synthetic resin sheet
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
Description
The broken lines represent environmental subject matter and portions of the synthetic sheet that form no part of the claim. The thickness of the synthetic resin sheet forms no part of the claim. The broken line showing of the bounds of the claimed design form no part thereof.
The synthetic resin sheet does not include perforations.
Claims
We claim the ornamental design for a synthetic resin sheet, as shown and described.
Referenced Cited
U.S. Patent Documents
D25340 | March 1896 | Morris |
D25341 | March 1896 | Morris |
D25678 | June 1896 | Morris |
D25679 | June 1896 | Morris |
D70685 | July 1926 | Humphreys |
D89770 | May 1933 | Knauer |
D104559 | May 1937 | Carter |
D166007 | February 1952 | Waite |
3722955 | March 1973 | Trotman |
D278468 | April 16, 1985 | Trotman et al. |
D636608 | April 26, 2011 | Ostendorf et al. |
20050011576 | January 20, 2005 | Dini |
Patent History
Patent number: D688047
Type: Grant
Filed: Jan 13, 2012
Date of Patent: Aug 20, 2013
Assignee: Samsung Electronics Co., Ltd. (Gyeonggi-do)
Inventors: Jidam Hong (Seoul), Hea Me Lee (Seoul)
Primary Examiner: Karen S Acker
Application Number: 29/410,956
Type: Grant
Filed: Jan 13, 2012
Date of Patent: Aug 20, 2013
Assignee: Samsung Electronics Co., Ltd. (Gyeonggi-do)
Inventors: Jidam Hong (Seoul), Hea Me Lee (Seoul)
Primary Examiner: Karen S Acker
Application Number: 29/410,956
Classifications
Current U.S. Class:
D5/58