Heat dissipating device

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Description

FIG. 1 is a perspective view of a heat dissipating device showing my new design.

FIG. 2 is a front elevational view of the heat dissipating device.

FIG. 3 is a rear elevational view of the heat dissipating device.

FIG. 4 is a left-side, elevational view of the heat dissipating device.

FIG. 5 is a right-side, elevational view of the heat dissipating device.

FIG. 6 is a top plan view of the heat dissipating device.

FIG. 7 is a bottom plan view of the heat dissipating device; and,

FIG. 8 is another perspective view of the heat dissipating device, showing a heat pipe interconnecting the heat dissipating device and a base, wherein the heat pipe and the base are shown in broken lines for illustrative environmental purposes only and form no part of the claimed design.

Claims

The ornamental design for a heat dissipating device, as shown and described.

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Patent History
Patent number: D694199
Type: Grant
Filed: Nov 30, 2012
Date of Patent: Nov 26, 2013
Assignee: Foxconn Technology Co., Ltd. (New Taipei)
Inventor: Yu-Ching Lin (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/438,467
Classifications
Current U.S. Class: Heat Sink (D13/179)