Electronic device
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Claims
The ornamental design for an electronic device, as shown and described.
5548478 | August 20, 1996 | Kumar et al. |
D425874 | May 30, 2000 | Tanimura |
6091600 | July 18, 2000 | Jeong |
6785128 | August 31, 2004 | Yun |
6816365 | November 9, 2004 | Hill et al. |
D615539 | May 11, 2010 | Jen |
D616883 | June 1, 2010 | Denhez et al. |
D631472 | January 25, 2011 | Kawase et al. |
8081438 | December 20, 2011 | Karashima et al. |
20050041378 | February 24, 2005 | Hamada et al. |
- “Thunderbolt (interface)” retrieved Aug. 7, 2012 from Wikipedia at http://en.wikipedia.org/wiki/Thunderbolt—%28interface%29 ; 7 pages.
- Nelson, Tom, “What is Thunderbolt High Speed I/O?”, retrieved Aug. 7, 2012 from http://macs.about.com/od/faq1/f/What-Is-Thunderbolt-High-Speed-I-O.htm ; 2 pages.
- Intel Corporation Technology Brief, “Thunderbolt Technology”, copyright 2012. Retrieved Aug. 7, 2012 from http://www.intel.com/content/dam/doc/technology-brief/thunderbolt-technology-brief.pdf ; 4 pages.
- VAIO 13.1″ Z Series Laptop; retrieved Jul. 31, 2012 from http://store.sony.com/webapp/wcs/stores/servlet/ProductDisplay?catalogId=10551&storeId=10151&langId=-1&productId=8198552921666449851#additionalImage1″ , 3 pages.
Type: Grant
Filed: Jul 30, 2012
Date of Patent: Dec 3, 2013
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: James M. Okuley (Portland, OR), Kimi Jensen (Beaverton, OR)
Primary Examiner: Freda S Nunn
Application Number: 29/428,400