Hemanalysis apparatus
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
Description
The broken lines in the drawing views are included for the purpose of illustrating the unclaimed portions of the hemanalysis apparatus and form no part of the claimed design.
Claims
The ornamental design for a hemanalysis apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
4628026 | December 9, 1986 | Gardell et al. |
D297763 | September 20, 1988 | Daynes |
D381749 | July 29, 1997 | Lawrence et al. |
D537951 | March 6, 2007 | Okamoto et al. |
D549827 | August 28, 2007 | Maeno et al. |
D571474 | June 17, 2008 | Sjo-Gaber et al. |
D599234 | September 1, 2009 | Ito |
D621523 | August 10, 2010 | Onuma et al. |
D631968 | February 1, 2011 | Sevel |
D680657 | April 23, 2013 | Lee et al. |
D682441 | May 14, 2013 | Kim |
Patent History
Patent number: D694888
Type: Grant
Filed: Nov 21, 2012
Date of Patent: Dec 3, 2013
Assignee: Samsung Electronics Co., Ltd.
Inventors: Yeon-Moo Chung (Seoul), Jun-Pil Moon (Seoul)
Primary Examiner: Anhdao Doan
Application Number: 29/437,936
Type: Grant
Filed: Nov 21, 2012
Date of Patent: Dec 3, 2013
Assignee: Samsung Electronics Co., Ltd.
Inventors: Yeon-Moo Chung (Seoul), Jun-Pil Moon (Seoul)
Primary Examiner: Anhdao Doan
Application Number: 29/437,936
Classifications