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FIG. 1 is a perspective view of headphones showing my new design, the opposite perspective view of the interior surface of the earcup is a mirror image;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.


The ornamental design for headphones, as shown and described.

Referenced Cited

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Patent History

Patent number: D699702
Type: Grant
Filed: Aug 29, 2012
Date of Patent: Feb 18, 2014
Assignee: Yoga Electronics Co., Ltd. (Taipei)
Inventor: Chin-Chun Chen (Taipei)
Primary Examiner: Paula Greene
Application Number: 29/430,707


Current U.S. Class: Headphone Or Headset (D14/205)