Housing for electronic modules with cooling fins

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Description

FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.

FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,

FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.

The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.

Claims

The ornamental design for a housing for electronic modules with cooling fins, as shown and described.

Referenced Cited
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Patent History
Patent number: D722576
Type: Grant
Filed: Jan 9, 2014
Date of Patent: Feb 17, 2015
Assignee: Liebherr-Elektronik GmbH (Lindau)
Inventor: Martin Zimmer (Tettnang)
Primary Examiner: Selina Sikder
Application Number: 29/478,926
Classifications
Current U.S. Class: Heat Sink (D13/179)